Technology and Capability

Surface

Gold plating\HAL\OSP\Gold finger

Max. Board Size

600mm*700mm

Min. Board Size

5mm*5mm

Warp age

Single-side<1.0%,Double-side<0.6%,Multilayer<0.6%

Min. Thickness & Tolerance

0.2mm+0.08mm

Min. Line Width / Space & Tolerance

HAL PCB: 0.10mm+20% (4mil+20%)
Gold PCB: 0.075mm+20% (3mil+20%)

Copper to Edge-board Spacing

0.5mm (20mil)

Hole side to Edge-board Spacing

0.3mm (7.87mil)

Min. Hole Size & Tolerance

0.3mm+0.076mm (12mil+3mil)

Min. Hole Space & Tolerance

0.4mm+0.076mm (15.75mil+3mil)

Hole Wall Thickness

20-25um (0.79mil-1.0mil)

Hole Position Deviation

+0.076mm (+3mil)

Min. Round Hole Dia.(for Punch)

1.0mm(40mil) with PCB thickness <FR-4 1.0mm;
1.5mm(59mil) with PCB thickness FR4 1.2-3.0mm (47mil-120mil)

Min. Square Figure hole Dia.(for Punch)

0.8MM x 0.8mm(31.5mil x 31.5mil) with PCB thickness < FR-4 & CEM-3 1.0mm;
1.0mm x 1.0mm(40mil x 40mil) with PCB thickness FR-4 & CEM-3 1.2-3.00mm(47mil-120mil)

Finished Board Size Tolerance

CNC: +0.1mm(+4mil); Punch: +0.15mm(+6mil)

V-cut Position Tolerance

+0.2mm(+8mil)

Base Material Thickness

0.2-3.5mm

Base Material Copper Thickness

18um, 35um, 70um

Plating Coat Thickness

Gold Plating: Ni 2.5-5um Au 0.05-0.1um
Gold Immersion: Ni 5-8um Au 0.08-0.12um
Gold Finger: Ni 2.5-5um Au 0.08-0.12um

Profile

CNC, Punch

V-cut Angle Tolerance

+5°

V-cut PCB Material Thickness Range

0.6mm-3.2mm (15.5mil-129.58mil)

Min. SMD Space

0.3mm (12mil)

Min. Components Marking Symbol

0.15mm (5.9mil)

Min. Land Single Side Width (Finished PCB)

0.15mm (5.9mil)

Min. Solder Mask Clearance

0.076mm (0.3mil)

Min. Solder Mask Bridge

+0.076mm (0.3mil)